Tool and method for the theremal transient evaluation of packages

Vladimir Szekely; Marta Rencz; Bernard Courtois

doi:10.1117/12.368429

8 October 1999 Tool and method for the theremal transient evaluation of packages

Vladimir Szekely, Marta Rencz, Bernard Courtois

Proceedings Volume 3893, Design, Characterization, and Packaging for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.368429
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

This paper presents a new concept for the thermal transient measurement of IC packages. The TTMK thermal transient test kit described here consists of a test chip, a dedicated software running on a PC and a special cable connecting the PC to the IC package which encapsulates the test chip. The function of the thermal transient test equipment is realized partly by the test chip itself and partly by the measuring software. The software performs both the control of the measurements and the evaluation of the results. The output of the evaluation software may be a compact model network or the structure function describing the properties of the heat conduction path. The use of the TTMK kit and the capabilities of the evaluation software are presented in this paper.

Citation Download Citation

Vladimir Szekely, Marta Rencz, and Bernard Courtois "Tool and method for the theremal transient evaluation of packages", Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); https://doi.org/10.1117/12.368429

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