11 November 1999 Mechanical behavior measurement of wood by ESPI method
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Proceedings Volume 3897, Advanced Photonic Sensors and Applications; (1999) https://doi.org/10.1117/12.369340
Event: International Symposium on Photonics and Applications, 1999, Singapore, Singapore
In this paper, a non-destructive testing technique, based on electronic speckle pattern interferometry, is presented to measure 4-point bending of wood. The mechanical behavior of the wood, such as Poisson Ratio can be obtained from the test result. To measure the out of plane displacement produced by 4-point bending, the wood specimen which is 33 X 3 X 3 mm, is secured in a special loading device. The loading device can produce 4- point bending symmetrically. The device with the specimen is put in a Michelson electronic speckle pattern interferometer assembly. Speckle pattern is produced on the natural 'rough' surface of the wood when illuminated by laser. A series of laser speckle interferograms are captured by a CCD camera and then sequentially subtracted to reveal deformation of the surface. Correlation fringes can be obtained while the load is applied. Both experimental results and theoretical analysis are presented.
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Lijun Jiang, Anand Krishna Asundi, and Kathrin Winkelmann "Mechanical behavior measurement of wood by ESPI method", Proc. SPIE 3897, Advanced Photonic Sensors and Applications, (11 November 1999); doi: 10.1117/12.369340; https://doi.org/10.1117/12.369340

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