Electron Beam Systems At IBM Status Report

Edward V. Weber

doi:10.1117/12.935093

7 November 1983 Electron Beam Systems At IBM Status Report

Edward V. Weber

Proceedings Volume 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II; (1983) https://doi.org/10.1117/12.935093
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

For over ten years IBM has been pursuing Manufacturing Electron Beam Systems in Manufacturing for direct wafer lithography exposure. These efforts have resulted in three generations of systems for wafer exposure, each with a greater capability. These systems have been configured to minimize system ailments and to maximize throughput. Their principal application has been to reduce turn around time. They have provided satisfactory service in Manufacturing and in Development applications. Having proved themselves to be beneficial and reliable Manufacturing tools, electron beams are being implemented for additional applications. Mask exposure, mask inspection and module inspection are some of the newer applications for E-Beam systems, in IBM at East Fishkill.

Citation Download Citation

Edward V. Weber "Electron Beam Systems At IBM Status Report", Proc. SPIE 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II, (7 November 1983); https://doi.org/10.1117/12.935093

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available