7 June 2000 Laser chemical process for clean applications of semiconductor manufacturing
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Proceedings Volume 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V; (2000) https://doi.org/10.1117/12.387543
Event: Symposium on High-Power Lasers and Applications, 2000, San Jose, CA, United States
Abstract
Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O2/O3/NF3 gases. The process involves ozone blast wave, photodecomposition of O3 into O radicals, photo-thermal decomposition of NF3 into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Yogev, Michael Y. Engel, Shaike Zeid, Izhack Barzilay, Boris Livshits, "Laser chemical process for clean applications of semiconductor manufacturing", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); doi: 10.1117/12.387543; https://doi.org/10.1117/12.387543
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