Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique

A Marsh

doi:10.1117/12.935118

7 November 1983 Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique

A Marsh

Author Affiliations +

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935118
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

Sidewall erosion in plasma etching is employed to obtain sub-micron features derived from 1.5 to gum sized features which are printed in a standard scanning UV projector. The smallest features reliably obtained are 0.3μm wide.

Citation Download Citation

A Marsh "Printing Sub-Micron Features Beyond The Normal Ootical Resolution Limit Using A Multi-Level Resist Technique", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935118

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