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27 April 2000 Incorporation of MT ferrule and ribbon technology into optical backplane systems
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Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384420
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States
Abstract
This paper details several patented optical backplane interconnect system design for harsh environments. These optical backplanes provide an extremely high bandwidth interconnect structure capable of supporting today's and tomorrow's optical-electrical transducer technology, permitting the insertion of the next generation processing technology without upgrading/replacing the backplane interconnect structure itself. Additionally, the design of several robust, high optical density, cylindrical connectors is discussed, which extend the high-bandwidth optical connectivity beyond the backplane, permitting the integration of multiple physically federated 'boxes' into one computationally integrated system.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ritch A. Selfridge "Incorporation of MT ferrule and ribbon technology into optical backplane systems", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); https://doi.org/10.1117/12.384420
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