27 April 2000 MT-compatible red VCSEL module for parallel optical interconnections
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Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384392
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States
In this paper we present the design, fabrication and characterization of a module which directly connectorizes a 1 by 8 red VCSEL array to a small diameter polymer optical fiber array, using a standard MT ferrule. The facets of the POF are prepared by a hot knife cutting, followed by a short polishing step. First coupling results show total losses in the range of 1.1 dB/channel for a 30 cm POF link. Optical crosstalk between adjacent channels is below -45 dB. Plastic micromachined parts surrounding the VCSEL chip ensure the correct alignment of the connector, using the connector, using the connector guiding points. The parts themselves are aligned to the chip with a n index-alignment technique, using an excimer laser ablated mastertool. In a deconnectorizable version of the module, a thin, flat glue layer on the chip acts as a window between the VCSEL chip and the MT terminated POF array. Integrated in a standard ceramic package, clear eye diagrams have been measured at 150 MHz for a 10m POF link, coupled to the VCSEL array. Further efforts on higher speed measurements using dedicated drivers, will also be presented.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
An Van Hove, An Van Hove, Koen Van de Putte, Koen Van de Putte, Kris Naessens, Kris Naessens, Bart Dhoedt, Bart Dhoedt, Roel G. Baets, Roel G. Baets, Peter Van Daele, Peter Van Daele, } "MT-compatible red VCSEL module for parallel optical interconnections", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384392; https://doi.org/10.1117/12.384392

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