27 April 2000 Packaging technology of OptoBGA for 2.4 Gb/s
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Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384416
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States
The significantly increasing transmission capacity in the subscriber system are accelerating demands for higher data transmission speed, low cost, and system miniaturization in the millennium approaches. The key solution for the demands, smaller, lower cost, and high performance package, is surface technology. OptoBGA package has been developed to meet this challenge, a surface mountable type optical package that is designed for high frequency transmission speeds. OptoBGA package has a BGA structure to bring forth effectively size and cost reduction for the packaging. OptoBGA consists of ceramic material, a robust material, which has many advantages such as design flexibility with fine design rule, ease of process technology, high performance, and high reliability. The design of OptoBGA was made possible by improvement in the physical structure. The results of this research produced an OptoBGA with a return loss of about -20dB at 10GHz. Furthermore, reliability test evaluations have been conducted to demonstrate that the OptoBGA can withstand harsh environments.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mitsuo Yanagisawa, Mitsuo Yanagisawa, Hisayoshi Wada, Hisayoshi Wada, Seigo Matsuzono, Seigo Matsuzono, Shingo Sato, Shingo Sato, Shin Matsuda, Shin Matsuda, Satoshi Ooike, Satoshi Ooike, Shigeo Tanahashi, Shigeo Tanahashi, Shoji Uegaki, Shoji Uegaki, } "Packaging technology of OptoBGA for 2.4 Gb/s", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); doi: 10.1117/12.384416; https://doi.org/10.1117/12.384416

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