Finite element modeling for the flexural vibration of damped sandwich beams considering complex modulus of the adhesive layer

Yanchu Xu; Dennis Chen

doi:10.1117/12.384553

27 April 2000 Finite element modeling for the flexural vibration of damped sandwich beams considering complex modulus of the adhesive layer

Yanchu Xu, Dennis Chen

Author Affiliations +

Proceedings Volume 3989, Smart Structures and Materials 2000: Damping and Isolation; (2000) https://doi.org/10.1117/12.384553
Event: SPIE's 7th Annual International Symposium on Smart Structures and Materials, 2000, Newport Beach, CA, United States

Abstract

A new finite element type, compound beam element, is derived for sandwich beam by considering the effects of both shear and thickness deformation in the adhesive layer. The new element type overcomes some limitations with the conventional finite element method, in which modal strain energy method is normally used for structural damping analysis. Modal strain energy method becomes quite inaccurate when the damping of the structure becomes high because it is always assumed that the structural modal shapes are real while actual modal shapes of the damped structures are quite complex. For achieving the best damping effect, the thickness of the damping layer is normally very thin, which requires great amount of elements in conventional finite element modeling to get a proper aspect ratio for accurate prediction. In compound beam element, all base beam layers and adhesive layer are modeled into a single element. The use of the element will result in significant simplification of sandwich beam modeling and dramatic reduction of element density while maintaining the desired accuracy. The use of the element also allows consideration of complex modulus of the adhesive material in the analysis and calculation of complex modal shapes of the damped structure.

Citation Download Citation

Yanchu Xu and Dennis Chen "Finite element modeling for the flexural vibration of damped sandwich beams considering complex modulus of the adhesive layer", Proc. SPIE 3989, Smart Structures and Materials 2000: Damping and Isolation, (27 April 2000); https://doi.org/10.1117/12.384553

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