Finite element analysis of electric-field-assisted bonding

James G. Boyd; Eniko T. Enikov

doi:10.1117/12.388215

14 June 2000 Finite element analysis of electric-field-assisted bonding

James G. Boyd, Eniko T. Enikov

Proceedings Volume 3992, Smart Structures and Materials 2000: Active Materials: Behavior and Mechanics; (2000) https://doi.org/10.1117/12.388215
Event: SPIE's 7th Annual International Symposium on Smart Structures and Materials, 2000, Newport Beach, CA, United States

Abstract

An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss' law, and the linear momentum equations are placed in a finite element formulation, which is used to predict the evolution of the sodium ion concentration, electric potential, and stress during anodic bonding of Pyrex glass and silicon.

Citation Download Citation

James G. Boyd and Eniko T. Enikov "Finite element analysis of electric-field-assisted bonding", Proc. SPIE 3992, Smart Structures and Materials 2000: Active Materials: Behavior and Mechanics, (14 June 2000); https://doi.org/10.1117/12.388215

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