Step and stamp imprint lithography using a commercial flip chip bonder

Tomi Haatainen; Jouni Ahopelto; Gabi Gruetzner; Marion Finck; Karl Pfeiffer

doi:10.1117/12.390036

21 July 2000 Step and stamp imprint lithography using a commercial flip chip bonder

Tomi Haatainen, Jouni Ahopelto, Gabi Gruetzner, Marion Finck, Karl Pfeiffer

Proceedings Volume 3997, Emerging Lithographic Technologies IV; (2000) https://doi.org/10.1117/12.390036
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

In this work we describe a new method suitable for large area nanoimprint lithography. In step&stamp process the pattern on a stamp is transferred into a polymer layer on the substrate by repeating a step&stamp cycle. The method is demonstrated by imprinting matrices of test structures on polymer-coated 100 mm silicon wafers. A new polymer, PPM, is used as resist in the experiments. The polymer has been developed to fulfill the demands of imprint lithography. Patterns with sizes down to 400 nm were imprinted into either 100 nm or 340 nm thick PPM resist. After thinning in oxygen plasma, the resist layer is used as etching mask or for fabrication of interdigitated aluminum fingers by lift-off.

Citation Download Citation

Tomi Haatainen, Jouni Ahopelto, Gabi Gruetzner, Marion Finck, and Karl Pfeiffer "Step and stamp imprint lithography using a commercial flip chip bonder", Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); https://doi.org/10.1117/12.390036

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