Paper
2 June 2000 Automatic macro inspection system
Toshiaki Kitamura, Yasuharu Nakajima, Hiroyuki Matsumoto, Takeo Omori, Koichiro Komatsu
Author Affiliations +
Abstract
Macro defect inspection in the photolithography process has been operated by the operator's naked eye. Operator's inspection performance is not constant and depends on his skill, even if these macro defects are determined as the large scale defect. This paper reports our fully automated macro inspection system and its performance data that were evaluated in the production Fab. Our new system, Nikon AMI-2000, is designed to use the diffraction light imaging which is very effective to detect defocus defects and is designed to use an image processing method. This system has much higher sensitivity than operator inspection, the capability of constant yield management and has a high throughput performance.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshiaki Kitamura, Yasuharu Nakajima, Hiroyuki Matsumoto, Takeo Omori, and Koichiro Komatsu "Automatic macro inspection system", Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); https://doi.org/10.1117/12.386514
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Semiconducting wafers

Inspection

Diffraction

Image processing

Imaging systems

Defect detection

Wafer-level optics

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