2 June 2000 New voltage-contrast imaging method for detection of electrical failures
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Abstract
A new voltage contrast imaging method using single scan of high current electron beam has been developed. This method achieved the automatic inspection system, which detects electrical failures in acceptable amount of time. The sensitivity of the system is evaluated using open failure of via holes. First, the image contrast of poly-Si deposited on defective via holes is measured. Then the cross section of the defects is examined to obtain the correlation between contrast and the thickness of resistive residue at the bottom of the defective via holes. The result shows that this imaging method is capable of detecting 2 nm oxide remaining at the bottom of via.
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Mari Nozoe, Hidetoshi Nishiyama, Hiroyuki Shinada, Maki Tanaka, "New voltage-contrast imaging method for detection of electrical failures", Proc. SPIE 3998, Metrology, Inspection, and Process Control for Microlithography XIV, (2 June 2000); doi: 10.1117/12.386512; https://doi.org/10.1117/12.386512
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