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23 June 2000 Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters
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Abstract
SU-8 has great potential in low cost ultra-thick high aspect ratio MEMS applications. Although a broad range of thickness (from micrometer to mm) can be obtained by spin coating, the works about the sidewall profile and dimension control of SU-8 microstructures have not been published in detail. This paper describes the detailed investigations on the effects of processing parameters such as UV wavelength and exposure dose on dimensional change and sidewall profile of SU-8 microstructures. The optimized processing parameters for SU-8 structures with the thickness from 10 to 360 micrometer are presented.
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Zhong Geng Ling, Kun Lian, and Linke Jian "Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters", Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); https://doi.org/10.1117/12.388266
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