5 July 2000 OPC for logic and embedded applications: the reverse approach
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Abstract
In this paper we demonstrate a method of correcting optical proximity effects, which is specifically tailored for logic applications. Since the lithographic process window for printing logic features is predominantly determined by isolated lines, it makes sense to optimize the exposure conditions for isolated features, and then correct more nested features. As a result, the common process window is improved. Another benefit from this technique is that a smaller fraction of structures has to be corrected, thus reducing computation time and data volume. This makes this method useful also for logic application with embedded dense features.
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Uwe Paul Schroeder, Uwe Paul Schroeder, Tobias Mono, Tobias Mono, "OPC for logic and embedded applications: the reverse approach", Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); doi: 10.1117/12.388933; https://doi.org/10.1117/12.388933
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