Structure end foreshortening: lithography-driven design limitations

Uwe Paul Schroeder; Dennis J. Warner

doi:10.1117/12.388930

5 July 2000 Structure end foreshortening: lithography-driven design limitations

Uwe Paul Schroeder, Dennis J. Warner

Proceedings Volume 4000, Optical Microlithography XIII; (2000) https://doi.org/10.1117/12.388930
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

Especially in logic lithography, the issue of end foreshortening becomes more and more relevant with increasingly small dimension of the printed patterns. This study examines the effect of illumination condition, mask type, and various feature types on space end foreshortening at 150nm ground rules. special emphasis is put on end foreshortening induced design limitations, which may prevent linear shrinks. Data from aerial image simulations, and from experimental data on specially designed test masks suggest that especially the variation of the end foreshortening as a function of defocus has to be considered. The most critical geometry is that of nested and butting space ends at minimum ground rules, where the foreshortening cannot be compensated completely by OPC.

Citation Download Citation

Uwe Paul Schroeder and Dennis J. Warner "Structure end foreshortening: lithography-driven design limitations", Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); https://doi.org/10.1117/12.388930

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available