10 April 2000 High-level fault modeling in surface-micromachined MEMS
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382298
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
MEMS structures rendered defective by particles are modeled a tthe scehamtic-level using existing models of fault-free MEMS primitives within the nodal simulator NODAS. We have compared the results of schematic-level fault simulations with low-level finite element analysis and demonstrated the efficacy of such an approach. Analysis shows that NODAS achieves a 60X speedup over FEA with little accuracy loss in modeling defects caused by particles.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nilmoni Deb, Nilmoni Deb, Ronald D. Shawn Blanton, Ronald D. Shawn Blanton, } "High-level fault modeling in surface-micromachined MEMS", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382298; https://doi.org/10.1117/12.382298


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