10 April 2000 MEMS IC test probe utilizing fritting contacts
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382300
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
The emerging MEMS technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role of technological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses response to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshihiro Itoh, Toshihiro Itoh, Kenichi Kataoka, Kenichi Kataoka, Gunter Engelmann, Gunter Engelmann, Juergen Wolf, Juergen Wolf, Oswin Ehrmann, Oswin Ehrmann, Herbert Reichl, Herbert Reichl, Tadatomo Suga, Tadatomo Suga, "MEMS IC test probe utilizing fritting contacts", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382300; https://doi.org/10.1117/12.382300

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