10 April 2000 MEMS physical analysis in order to complete experimental results return
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000); doi: 10.1117/12.382299
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
The emerging MicroElectroMechanical Systems (MEMS) technologies are entering in an active phase of high volume production and successful commercial applications. The expertise and the qualification for space application of such devices have already begun. But these technologies are still recent and important efforts on the reliability issue have to be done. This paper defines the role oftechnological analysis in the actual MEMS design process. Afterwards, it presents MEMS technological analysis techniques developed at CNES applied to an open MEMS technology. In particular, it is shown how these technological analyses respond to designer needs and that the designer and the founder still need a strong interaction. We also present the MEMS reliability issue at CNES and replace it in the current world's one.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xavier Lafontan, Christian Dufaza, Guy Perez, Francis Pressecq, "MEMS physical analysis in order to complete experimental results return", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382299; https://doi.org/10.1117/12.382299
PROCEEDINGS
8 PAGES


SHARE
KEYWORDS
Microelectromechanical systems

Polishing

Computer aided design

Confocal microscopy

Reliability

Epoxies

Gold

RELATED CONTENT


Back to Top