10 April 2000 Mixed-technology system-level simulation
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Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382291
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
We employ Modified Nodal Matrix representation, piecewise linear modeling of non-linear devices, and piecewise characterization of signals to accomplish the simulation of mixed technology system. Piecewise simulation modeling for both optoelectronic and mechanical devices is used to decrease the computational task and allow for a trade-off between accuracy and speed. The extraction from device level simulation of circuit models, which characterize high level effects in optoelectronic or mechanical devices, allows for the inclusion of these effects into traditional circuit representations for the device. This technique improves the overall simulation accuracy without compromising the efficiency of the simulator. The additional advantage of using the same technique to characterize electrical and mechanical models allows us to easily merge both technologies in complex devices that interact in mixed domains.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven Peter Levitan, Jose A. Martinez, Timothy P. Kurzweg, Philippe J. Marchand, Donald M. Chiarulli, "Mixed-technology system-level simulation", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382291; https://doi.org/10.1117/12.382291
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