10 April 2000 New methodology of work with concurrent engineering in electronic design
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Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000); doi: 10.1117/12.382312
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
This paper aims at proposing a new enhanced way of working in electronic design. In fact, the design of an electronic component requires many competencies and skills, and the joint effort of several researchers and engineers, not necessarily located a the same lace. With traditional ways of work and communication tools, the interactivity level is reduced and it seems that the product life cycle cannot be improved significantly anymore. As a response, the technological progress in high speed networks and new communication and interaction tools open the way to concurrent engineering. This paper then aims at presenting such way of working, the new functionalities provided to users, and of course the benefits they can gain. As a case study, an actual example in the domain of electronics design illustrates this paper.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. Owezarski, V. Baudin, S. Owezarski, G. Fabre, T. Gayraud, J. M. Dorkel, P. Tounsi, "New methodology of work with concurrent engineering in electronic design", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); doi: 10.1117/12.382312; https://doi.org/10.1117/12.382312
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KEYWORDS
Computer aided design

Field effect transistors

Internet

Communication engineering

Solid modeling

Data modeling

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