30 March 2000 IR imaging of cracks excited by an ultrasonic pulse
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We describe a new hybrid ultrasonic/infrared technology in which ha short single pulse of ultrasound is used to cause cracks to heat up and become visible in the infrared. A low frequency (say 10's of kHz) ultrasonic transducer infuses the sample with sound. Where cracks, disbonds, delaminations or other defects are present, the sound field causes the defect to heat locally. The technique is applicable to large and irregularly shaped objects. We present a variety of images to show the capability for this technique to image cracks and other defects in metals as well as other materials. Both surface-interrupting and subsurface cracks are imaged. The technique can utilize hand-held ultrasonic sources, is insensitive to the position of the source on the sample, and yields wide-area images, with the defects showing as bright (higher temperature) regions against a dark (lower temperature) background. It can be used for inspection of relatively inaccessible complex part geometries.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lawrence D. Favro, Lawrence D. Favro, Xiaoyan Han, Xiaoyan Han, Zhong Ouyang, Zhong Ouyang, Gang Sun, Gang Sun, Hua Sui, Hua Sui, Robert L. Thomas, Robert L. Thomas, } "IR imaging of cracks excited by an ultrasonic pulse", Proc. SPIE 4020, Thermosense XXII, (30 March 2000); doi: 10.1117/12.381549; https://doi.org/10.1117/12.381549


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