17 July 2000 Long linear HgCdTe arrays with superior temperature cycling reliability
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Abstract
To meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit,' AIM has developed a Multi-Chip-Module approach for the infrared Focal-Plane-Array. Bonding of detector array and Si-chips on a sapphire substrate minimizes thermal stress and strain in the FPA, leading to cycle-to-failure of >= 1000. For maximum cycle estimation under varying strain, a correlation was established empirically.
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Johann Ziegler, Johann Ziegler, Marcus Finck, Marcus Finck, Rolf Krueger, Rolf Krueger, Thomas Simon, Thomas Simon, C. Joachim Wendler, C. Joachim Wendler, } "Long linear HgCdTe arrays with superior temperature cycling reliability", Proc. SPIE 4028, Infrared Detectors and Focal Plane Arrays VI, (17 July 2000); doi: 10.1117/12.391751; https://doi.org/10.1117/12.391751
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