19 July 2000 Requirements for lithography and mask technology from the standpoint of system LSI business
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Proceedings Volume 4066, Photomask and Next-Generation Lithography Mask Technology VII; (2000) https://doi.org/10.1117/12.392024
Event: Photomask and Next Generation Lithography Mask Technology VII, 2000, Kanagawa, Japan
Abstract
The SLI business embraces inherent problems in relation to silicon process and design implementation. As the technology becomes more complex and geometries become smaller, shortening TAT and reducing costs become ever more urgent and significant tasks. Efforts are currently being made, particularly in the field of compilable total solutions, to shorten TAT and to re-use modules so as to reduce costs. In the trend towards smaller geometries, TAT and costs related to the mask process are becoming significant factors. It is necessary to optimize the entire prices from design to MDP, mask-making and lithography and thereby improve pattern precision, reduce EB writer shots, achieve greater mask latitude and identify true defects. It will also be necessary to re-use the lithography model during MDP and to use a consistent data hierarchy and a consistent data format.
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Keiichi Kawate, Keiichi Kawate, Tadahiro Takigawa, Tadahiro Takigawa, Hidemi Ishiuchi, Hidemi Ishiuchi, Mineo Goto, Mineo Goto, "Requirements for lithography and mask technology from the standpoint of system LSI business", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); doi: 10.1117/12.392024; https://doi.org/10.1117/12.392024
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