1 September 2000 Microfabrication and packaging of deformable mirror devices
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Proceedings Volume 4075, Micro-Opto-Electro-Mechanical Systems; (2000) https://doi.org/10.1117/12.397934
Event: Symposium on Applied Photonics, 2000, Glasgow, United Kingdom
Abstract
We describe the fabrication and testing of deformable membrane mirrors over silicon backplanes using our in-house CMOS processing facilities. The fabrication of dense arrays of electrostatic actuators on the backplane potentially allows fine control of the membrane surface shape than can be produced when using a printed circuit board as the backplane. We presents a range of techniques for fabrication the membrane mirrors in various materials and mating the structure to a silicon backplane. We characterise membrane deflection with electric field for silicon nitride and polymer membranes over a passive silicon backplane consisting of 37 directly-addressed electrode pads configured in a hexagonal array.
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Alan W.S. Ross, Stephen C. Graham, Alan M. Gundlach, J. Tom M. Stevenson, William J. Hossack, David G. Vass, Georg K.H. Bodammer, Euan Smith, Kevin Ward, "Microfabrication and packaging of deformable mirror devices", Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000); doi: 10.1117/12.397934; https://doi.org/10.1117/12.397934
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