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1 September 2000 Tolerance and precision study for solder self-assembled MEMS
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Proceedings Volume 4075, Micro-Opto-Electro-Mechanical Systems; (2000)
Event: Symposium on Applied Photonics, 2000, Glasgow, United Kingdom
Surface tension self-assembly of MEMS has been shown to be an excellent approach for assembling three-dimensional MEMS structures by allowing more precise alignments and vastly increased complexity. This paper investigates and addresses some of the factors that limit the precision of surface tension self-assembly. Each factor can be analyzed and addressed for a simple structure, but for more complex structures, these effects need to be addressed additively and in unison. This paper also discusses, the additive tolerance effects of these structures and present several methods of tolerance analysis. The toleranceing, in conjunction with the precision analysis, will in the future allow for the creation of extremely precise surface tension self-assembled structures, allowing for the creation of MEMS applications that were previously unobtainable using any existing fabrication or packaging process.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin F. Harsh, Paul E. Kladitis, Yanhang Zhang, Martin L. Dunn, Victor M. Bright, and Y. C. Lee "Tolerance and precision study for solder self-assembled MEMS", Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000);

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