9 May 2000 Effect on properties of 42Sn58Bi solder joint by adding the 96.5Sn3.5Ag
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Proceedings Volume 4077, International Conference on Sensors and Control Techniques (ICSC 2000); (2000) https://doi.org/10.1117/12.385589
Event: International Conference on Sensors and Control Techniques (ICSC2000), 2000, Wuhan, China
Abstract
The different composition in 42Sn58Bi and 96.5Sn3.5Ag system has been studied. The reflow conditions of various composition pastes were studied, and a suitable adding of Sn-Ag paste could raise the soldering temperature of paste. It was found that the shear tensile strength of solder joint could be improved after adding suitable Sn-Ag to Sn-Bi paste by testing the solder joint tension. The thermal fatigue properties were studied through performed thermal annealing and thermal shocking. The shear tensile strength of solder joints for adding suitable Sn-Ag is higher than the pure Sn- Bi after thermal shocking. The solder property, mechanical and fatigue failure properties of solder joint for adding suitable Sn-Ag could be improved. It was found that suitable Sn-Ag could decrease the porosity in Sn-Bi solder joint thought X-ray and SEM analysis.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qinghua Tang, Xiaoguang Pan, C. M. L. Wu, Y. C. Chan, "Effect on properties of 42Sn58Bi solder joint by adding the 96.5Sn3.5Ag", Proc. SPIE 4077, International Conference on Sensors and Control Techniques (ICSC 2000), (9 May 2000); doi: 10.1117/12.385589; https://doi.org/10.1117/12.385589
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