Translator Disclaimer
Paper
11 July 2000 Finite-element analysis of solder joint strength in laser diode packaging
Author Affiliations +
Abstract
The effect of PbSn solder joint strength on temperature tests in laser diode packaging has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased. A finite-element method (FEM) analysis is performed on the calculation of joint strength of PbSn solder in temperature cycling tests for laser diode packaging. Numerical calculations were in good agreement with the experimental measurements that the solder joint strength increased as the temperature cycle increased. This is may be due to the redistribution of the residual stresses within the solder during the temperature cycling tests, and hence reducing the residual stresses and increasing the solder joint strength as the temperature cycle number increased. The result suggests that the FEM is an effective method for predicting the solder joint strength in laser diode packages.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-Hsiung Chang, Maw-Tyan Sheen, Jao-Hwa Kuang, Chi-Chen Chen, Gol-Lin Wang, Wood-Hi Cheng, Hung-Lon Chang, Szu-Chun Wang, Chungyung Wang, and Chih-Ming Wang "Finite-element analysis of solder joint strength in laser diode packaging", Proc. SPIE 4078, Optoelectronic Materials and Devices II, (11 July 2000); https://doi.org/10.1117/12.392199
PROCEEDINGS
6 PAGES


SHARE
Advertisement
Advertisement
Back to Top