6 November 2000 Hole drilling of glass substrates with a slab waveguide CO2 laser
Author Affiliations +
Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405747
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan
Abstract
Using 30-1000 (mu) s pulses and 9.3 (mu) m wavelength from a CO2 slab waveguide laser, focused to a spot size of 130 (mu) m, we have produced holes in synthetic quartz, soda-lime glass, and Pyrex glass substrates. In the three types of substrates, the mass removal per pulse increases almost linearly with the pulse energy used to vary the pulse interval. The removal rates of the three substrates are almost the same. We examine the effect of the pulse interval on the hole structure and the pile-up around the hole in single- and multiple-pulse hole drilling. The deformation on the pile-up region can be accounted by the melting walls of the hole. Moreover, we examine the effect of pulse energy on the inclination of the hole walls. A multiple-pulse hole shaping technique is effective in decreasing the height coefficient of the pile-up region and the angle of inclination.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshikazu Yoshida, Yoshikazu Yoshida, Yuji Kobayashi, Yuji Kobayashi, Tiejun Zhang, Tiejun Zhang, Hiroyoshi Yajima, Hiroyoshi Yajima, Yuji Hashidate, Yuji Hashidate, Hiroshi Ogura, Hiroshi Ogura, } "Hole drilling of glass substrates with a slab waveguide CO2 laser", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405747; https://doi.org/10.1117/12.405747
PROCEEDINGS
4 PAGES


SHARE
Back to Top