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6 November 2000 Laser processing system for microdrilling of printed circuit boards
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Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405681
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan
Abstract
Two laser processing systems for micro drilling of printed circuit boards and/or LSI packages are presented. One is a pulsed CO2 laser system and the other is a LD-pumped THG-YAG laser system, both are now commercially available.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Junichi Nishimae, Yukio Satoh, Tetsuo Kojima, and Tsukasa Fukushima "Laser processing system for microdrilling of printed circuit boards", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); https://doi.org/10.1117/12.405681
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