6 November 2000 Micromachining of transparent materials by laser ablation of organic solution
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Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000); doi: 10.1117/12.405687
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan
Abstract
Transparent materials such as fused silica, quartz, calcium fluoride, and fluorocarbon polymer were etched upon irradiation of organic solution containing pyrene with a conventional KrF excimer laser. Threshold fluence for etching was 240 mJ/cm2 for fused silica. Etch rate remarkably depended on a concentration of pyrene: higher etch rate with the increase of pyrene concentration. It means that pyrene molecules play an important role in this process. The etch rate can be easily controlled through changing a laser pulse number, a laser fluence and a concentration of solution. The mechanism for this process is discussed by cyclic multiphotonic absorption of pyrene in the excited states, thermal relaxation, and formation of super-heated solution. As the results, it is suggested that the process is based on the combination of two processes in the interface between the transparent materials and the liquid: one is a heating process by a super-heated liquid and the other is an attacking process by a high temperature and pressure vapor.
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Jun Wang, Hiroyuki Niino, Akira Yabe, "Micromachining of transparent materials by laser ablation of organic solution", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405687; https://doi.org/10.1117/12.405687
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KEYWORDS
Excimer lasers

Silica

Laser ablation

Etching

Polymers

Absorption

Liquids

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