2 November 2000 Calibration requirements for identifying and sizing wafer defects by scanner measurements
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Abstract
New particle scanner capabilities are needed to meet requirements for the next generation of devices in the semiconductor industry. Among these, defect identification and sizing are very important. This paper shows the key role of accurate scanner calibration to achieving these advances in scanner capability. An example, using modeled results from a hypothetical scanner geometry, analyzes the ability to discriminate surface pits from silicon particles for differing levels uncertainty in the PSL calibration spheres.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John C. Stover, Craig A. Scheer, "Calibration requirements for identifying and sizing wafer defects by scanner measurements", Proc. SPIE 4099, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries, (2 November 2000); doi: 10.1117/12.405832; https://doi.org/10.1117/12.405832
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