Paper
2 November 2000 Optical microscopy at sub-0.1-μm resolution for semiconductor applications
Author Affiliations +
Abstract
This paper addresses the possibilities and recent achievements in increasing significantly the resolution of optical microscopy for wafer and mask inspection and metrology. DUV microscopes operating at 248 nm wavelength already offer a feature size resolution down to 0.08 micrometers . Photon tunneling microscopy (solid immersion optics) allows to apply the higher resolution of immersion optics without bringing the immersion into contact with the specimen. First results are shown. A special illumination mode in laser confocal microscopy, the so called doughnut illumination, appears to have the potential for increasing the resolution by about 30% compared to classical laser confocal microscopy. It is shown that in the combination of these three methods an ultimate feature size resolution of about 25nm may be achieved- at least theoretically. The future will show if what seems to be physically feasible can be transformed to technical solutions.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wolfgang Vollrath "Optical microscopy at sub-0.1-μm resolution for semiconductor applications", Proc. SPIE 4099, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries, (2 November 2000); https://doi.org/10.1117/12.405825
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Deep ultraviolet

Microscopes

Objectives

Microscopy

Confocal microscopy

Optical microscopy

Semiconducting wafers

Back to Top