With the electronic industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time while satisfying electrical, thermal, and mechanical requirements, as well as cost and manufacturability. In addition, reliability and durability have to be taken into consideration. As a consequence, effective quantitative methodologies, such as optical and computational should be applied in the study and optimization of microelectronic components. In this paper, a hybridized use of nondestructive, noninvasive, remote, full field of view, quantitative opto-electronic holography techniques with computational modeling is presented. The hybridization is illustrated with a representative application, which shows that the combined use of opto-electronic holography techniques and computational modeling provides an effective engineering tool for nondestructive study and optimization of microelectronic components.