17 November 2000 High-performance computing based on 3D system assembly
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Successful transition from today's general-purpose programmable systems, based on the concept of planar topology, to tomorrows intelligent, highly adaptable and not necessarily programmable systems would require integration of several unorthodox approaches. We cannot predict exactly which technology will become post-CMOS and post-silicon computing mainstream. Whether it will belong to a quantum, molecular, DNA, optical, or neural paradigm, several speculations can be made to ease the transition and to create a processing infrastructure that will allow coexistence of today's semiconductor-based approach with its successor. An attempt is made here to introduce such a transitional architecture. The proposed concept of system architecture allows high- performance computing capabilities and high density free-space optical interconnects to be seamlessly integrated with power supply and cooling subsystems. This is achieved by bringing twenty hexagon-base and twelve pentagon-base pyramids into close proximity, forming truncated icosahedron. Each pyramid is an Integrated Processing-Power-supply-Cooling Module (IPPCM). IPPCM has a conical cavity within, which is occupied by a power supply/cooling unit; the optoelectronic components are attached to the faces of the pyramids. In the proposed instance, 180 trapezoidal multi-chip-processing modules, with total die-attach area equal to 2000cm2, are brought into a volume of less than two liters. By bringing multiple pyramids into close proximity to each other, a free-space optical link is formed for inter-pyramidal communication. Some of the spaces formed between pyramids can be used for future unorthodox processing technologies.
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Vladimir Gorelik, Vladimir Gorelik, } "High-performance computing based on 3D system assembly", Proc. SPIE 4109, Critical Technologies for the Future of Computing, (17 November 2000); doi: 10.1117/12.409228; https://doi.org/10.1117/12.409228


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