15 December 2000 Advanced visible/infrared microcameras for dual-use applications
Author Affiliations +
Irvine Sensors Corporation (ISC) has pioneered the use of a chip stacking technology that allows an entire electronics system to be packaged into a single 3-dimensional cube of electronics. This stacking approach allows the elimination of traditional printed circuit boards (PCB) and as a result significantly reduces the size of the electronics. Recently this technology has been applied to electronic camera applications including both high-resolution digital still picture and video camera technologies. In addition this electronics implementation approach is under evaluation for application in the SWIR and LWIR/thermal imaging spectral bands.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William B. Hornback, William B. Hornback, Charles S. Kaufman, Charles S. Kaufman, "Advanced visible/infrared microcameras for dual-use applications", Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000); doi: 10.1117/12.409905; https://doi.org/10.1117/12.409905


A miniature VGA SWIR camera using MT6415CA ROIC
Proceedings of SPIE (June 23 2014)
Efficiency Of Millimeter-Wave Horn Imaging Arrays
Proceedings of SPIE (November 17 1989)
Albion camera: a high-performance infrared imaging system
Proceedings of SPIE (August 29 2004)
Seagle-1: a new man-portable thermal imager
Proceedings of SPIE (June 27 2000)
How To Select Cameras For Machine Vision
Proceedings of SPIE (March 06 1989)
Digital IR imaging capability for medical applications
Proceedings of SPIE (July 12 1999)

Back to Top