Progress toward high-performance infrared imaging systems-on-a-chip

Lester J. Kozlowski; Kadri Vural; William E. Tennant; William E. Kleinhans; Isoris S. Gergis

doi:10.1117/12.409863

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15 December 2000 Progress toward high-performance infrared imaging systems-on-a-chip

Lester J. Kozlowski; Kadri Vural; William E. Tennant; William E. Kleinhans; Isoris S. Gergis

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Proceedings Volume 4130, Infrared Technology and Applications XXVI; (2000) https://doi.org/10.1117/12.409863
Event: International Symposium on Optical Science and Technology, 2000, San Diego, CA, United States

Abstract

Continuing advances in CMOS technology including finer lithography, the addition of dense planarized interconnect layers, concomitant improvements in transistor performance, and the availability of design tools that facilitate large- scale circuit integration, are now enabling the development of systems on a chip. While the first such imaging systems- on-a-chip supported detection of radiation at visible wavelengths, recent imaging systems-on-a-chip extend into the infrared. The result is high-performance infrared FPAs with high functionality. We report our progress at Rockwell Science Center in exploiting submicron CMOS to produce such infrared imaging systems-on-a-chip while overcoming accompanying challenges such as lower operating voltage. Our goal is to develop third-generation infrared imagers with compelling performance and functionality advantages that not only provide high sensitivity and resolution, but also facilitate on-demand sensor selection to adeptly match each mission without need for extensive support logistics including extensive cooling and elaborate camera electronics.

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Lester J. Kozlowski, Kadri Vural, William E. Tennant, William E. Kleinhans, and Isoris S. Gergis "Progress toward high-performance infrared imaging systems-on-a-chip", Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000); https://doi.org/10.1117/12.409863

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