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15 December 2000 Progress toward high-performance infrared imaging systems-on-a-chip
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Continuing advances in CMOS technology including finer lithography, the addition of dense planarized interconnect layers, concomitant improvements in transistor performance, and the availability of design tools that facilitate large- scale circuit integration, are now enabling the development of systems on a chip. While the first such imaging systems- on-a-chip supported detection of radiation at visible wavelengths, recent imaging systems-on-a-chip extend into the infrared. The result is high-performance infrared FPAs with high functionality. We report our progress at Rockwell Science Center in exploiting submicron CMOS to produce such infrared imaging systems-on-a-chip while overcoming accompanying challenges such as lower operating voltage. Our goal is to develop third-generation infrared imagers with compelling performance and functionality advantages that not only provide high sensitivity and resolution, but also facilitate on-demand sensor selection to adeptly match each mission without need for extensive support logistics including extensive cooling and elaborate camera electronics.
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Lester J. Kozlowski, Kadri Vural, William E. Tennant, William E. Kleinhans, and Isoris S. Gergis "Progress toward high-performance infrared imaging systems-on-a-chip", Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000);


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