5 January 2001 Hard x-ray multilayers: a study of different material systems
Author Affiliations +
Abstract
Multilayer structures with depth-graded spacing can show a high reflectivity in a broad energy passband for hard X-rays if the interface roughness/diffuseness is controlled and minimized. We present a study of several multilayer systems deposited by DC magnetron sputtering on <111> silicon wafers and superpolished fused silica substrates. The material combinations discussed are W/Si, WSi2/Si, W/C, Pt/C, Ni/C, Ni/B4C, and Mo/Si. The deposition method used was DC magnetron sputtering at low argon pressures (1.5 to 5 mT). The characterization methods used were: Atomic Force Microscopy in tapping mode, stylus profilometry, Rutherford backscattering, cross sectional TEM, and specular X-ray reflectivity (XRR) scans at 8.05 keV. Different process parameters were varied in order to optimize the interface roughness/diffuseness (sigma) that was measured by XRR scans.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Adrian Ivan, Adrian Ivan, Ricardo J. Bruni, Ricardo J. Bruni, Kyung Wha Byun, Kyung Wha Byun, Paul Gorenstein, Paul Gorenstein, Suzanne E. Romaine, Suzanne E. Romaine, } "Hard x-ray multilayers: a study of different material systems", Proc. SPIE 4145, Advances in X-Ray Optics, (5 January 2001); doi: 10.1117/12.411622; https://doi.org/10.1117/12.411622
PROCEEDINGS
8 PAGES


SHARE
Back to Top