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30 January 2001 Laser-assisted microshaping
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Proceedings Volume 4157, Laser-Assisted Microtechnology 2000; (2001)
Event: Laser-Assisted Microtechnology 2000, 2000, St. Petersburg-Pushkin, Russian Federation
Today the laser technologies are widely used in the processing of materials, including also the precise microshaping. Deep UV lasers have very good prospects in the lithograph, used for fabrication of chips, while the femtosecond pulsed lasers open the new horizons for the micro- and submicroprofiling. But these are the field of the future prospects. As for today's state-of-the-art, contribution to the application of lasers for these purposes are the numerous advantages of the laser techniques over the traditional methods, such as: wide variety of material to be treated, possibility of achieving narrow cuts and practically waste-free separation, small heat-affected zone, minimal mechanical effect and minimum thermal deformations, possibility of microshaping along a complex profile in two, or even three dimensions, possibility of fast and precise process switch-on and -off and to include in the processing feedback on the treated parameters.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vadim P. Veiko "Laser-assisted microshaping", Proc. SPIE 4157, Laser-Assisted Microtechnology 2000, (30 January 2001);

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