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25 August 2000 Formation of low-stress multilayered thick polysilicon films for fabrication of microsystems
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Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000)
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
The effects of impurity doping and heat treatments on the characteristics of thick polysilicon films were studied for development of the structural materials in the MEMS. In this study, 8-15 layers of 6.5-12 micrometers thickness polysilicon films were deposited to have a symmetrical structure using low-pressure chemical vapor deposition with a novel stacking method. We have measured the physical and structural characteristics using micromachined test patterns to verify the minimal stress and stress gradient in the polysilicon layers, according to the film stacking, doping, and thermal treatment methods. The multilayer film revealed the complex orientation composed of (100), (220) and (311) grains after annealing and showe4d a higher doping concentration induced a higher compressive stress of 70 Mpa since phosphorus gave rise to a compressive stress in a polysilicon film. However, the doping method for the most uniform distribution of phosphorus induced the lowest stress gradient among all samples. A polysilicon microresonator with thickness of 6.5 micrometers were manufactured by the symmetrical stacking and optimum doping method in which the dopant concentration was lowered and annealing at 1000 degrees C. The film had a low stress of 7.6 MPa and a low stress gradient of -0.15 MPa/micrometers and revealed good slopes of sidewalls after dry etching. The fabricated test structure for a micro gyroscope showed that the driving resonant frequency and the sensitivity was measured as 9,175 Hz and 5 mV-sec/deg under the condition of a static angular velocity, respectively.
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Chang-Auck Choi, Won-Ick Jang, Myung-Lae Lee, and Youn Tae Kim "Formation of low-stress multilayered thick polysilicon films for fabrication of microsystems", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000);

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