Low-temperature piezoelectric aluminum nitride thin film

Laurie Valbin; Laure Sevely; Serge Spirkovitch

doi:10.1117/12.396425

25 August 2000 Low-temperature piezoelectric aluminum nitride thin film

Laurie Valbin, Laure Sevely, Serge Spirkovitch

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396425
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

AlN films were deposited on Si(100), and Al/SiO₂/Si substrates by reactive Direct Current (DC) magnetron sputtering of an Al target, under different conditions of substrate temperature, pressure, N₂/N₂ + Ar ratio. The film properties were investigated by X-ray Diffraction, scanning electron microscopy and atomic force microscopy. Deposition rates in the range of 1.2 to 1.8 micrometers /h were obtained, the film grain size was around 40nm. To fabricate test structures, wet chemical etching was developed to etch AlN with a good selectivity respect to Al and Si. Visual aspect and surface roughness show that the maximum temperature must be less than 300 degrees C. X-ray diffraction together with dielectric constant measurement show that films are better oriented on Si(100) than on Al/Si(100).

Citation Download Citation

Laurie Valbin, Laure Sevely, and Serge Spirkovitch "Low-temperature piezoelectric aluminum nitride thin film", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396425

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