Novel low-temperature pressure-assisted bonding technology

Abdeljlail Sayah; Dominique Solignac; Martin A. M. Gijs

doi:10.1117/12.396455

25 August 2000 Novel low-temperature pressure-assisted bonding technology

Abdeljlail Sayah, Dominique Solignac, Martin A. M. Gijs

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396455
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

We introduce a new low temperature bonding technology to assemble two microstructured glass substrates for the realization of micro channels for chemical analysis applications. To realize the micro channels, we introduce, besides the well-known HF-etching technology, two simple alternative methods, namely sawing and micro-powder blasting. After proper cleaning of the two glass surfaces, direct bonding is obtained just by exposing the glass stack to a high pressure in the 100-200 degrees C temperature range. At these low temperatures, we obtain bonding strengths as high as 10 MPA, comparable to the best values reported in literature. As a possible mechanisms for this strong bonding, we propose the pressure-induced enhancement of the bonding contact surface.

Citation Download Citation

Abdeljlail Sayah, Dominique Solignac, and Martin A. M. Gijs "Novel low-temperature pressure-assisted bonding technology", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396455

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