25 August 2000 Packaging for a rotational accelerometer: Is a standard plastic SOIC an industrial solution?
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Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396457
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
On the contrary of microelectronics where standard packages like e.g. DIP, QFP, BGA, SOIC dominate, microsensor packaging seems to be characterized by custom and application-specific packages. Moreover, in microsensor applications packaging is typically a relevant cost component of the whole system. In this scenario, the main question to solve for a high volume and no product specific company mission is the following: how to design versatile, reliable, low-cost packages for microsensor. In this article the assembly solutions for a low-cost mass production of a rotational accelerometer sensor are shown. From the packaging design point of view, the stress minimization has been the main guideline for any assembly process and material characterization choice. The process and material issues, including numerical simulations, optimization by design and experiment, are discussed in detail. Breakthrough in this project were the wafer to wafer bonding as well as the die singulation, the die to die interconnection and the thermomechanical stress minimization.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Valter Motta, Valter Motta, Giovanni Frezza, Giovanni Frezza, Mariapia Riva, Mariapia Riva, Kritivasan Sivakumar, Kritivasan Sivakumar, } "Packaging for a rotational accelerometer: Is a standard plastic SOIC an industrial solution?", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396457; https://doi.org/10.1117/12.396457

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