25 August 2000 Wafer-level chip size package with an air cavity above the active surface for micromechanical applications
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Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396456
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
While package developers struggle to keep pace with the shrinking I/O pitch of the latest ICS, another challenge is being added by a new wave of micro-electro-mechanical systems. These devices combine standard IC circuitry with micro-moving silicon structures.
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Avner P. Badihi, Avner P. Badihi, } "Wafer-level chip size package with an air cavity above the active surface for micromechanical applications", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396456; https://doi.org/10.1117/12.396456
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