11 August 2000 Bulk micromachining for sensors and actuators
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Proceedings Volume 4175, Materials and Device Characterization in Micromachining III; (2000) https://doi.org/10.1117/12.395607
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Silicon bulk micromachining which is based on a silicon etching and a glass-silicon anodic bonding plays important roles to make micro sensors and micro actuators. Three dimensional microfabrication of other functional materials as piezoelectric materials are also important to develop high performance microactuators, micro energy source and so on. Vacuum sealing is required to prevent a viscous dumping for packages micromechanical sensors. Extremely small structures as microprobe are required for high resolution, high sensitivity and quick response. As sophisticated microsystems which are made of many sensors, circuits and actuators are required for example for maintenance tools used in a narrow space. Developments for those required will be described.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masayoshi Esashi, Masayoshi Esashi, } "Bulk micromachining for sensors and actuators", Proc. SPIE 4175, Materials and Device Characterization in Micromachining III, (11 August 2000); doi: 10.1117/12.395607; https://doi.org/10.1117/12.395607
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