11 August 2000 Peel-off probe: a cost-effective probe for electrical atomic force microscopy
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Proceedings Volume 4175, Materials and Device Characterization in Micromachining III; (2000) https://doi.org/10.1117/12.395612
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Full metal probes have proven their suitability for electrical atomic force microscopy (AFM) in the last few years. Such probes could be fabricated cheaper if one reduces the number of steps and processing time. Therefore we have developed a procedure which allows to manufacture full metal probes with only two lithography steps. The etching of thin membranes is dropped which reduces the processing time by 25% compared to our previous procedure. It requires only topside processing. The probes can be peeled off from the wafer due to a special metallization procedure. This paper discusses the process scheme and presents measurements on semiconductor devices.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Hantschel, Stefan Slesazeck, N. Duhayon, Mingwei Xu, Wilfried Vandervorst, "Peel-off probe: a cost-effective probe for electrical atomic force microscopy", Proc. SPIE 4175, Materials and Device Characterization in Micromachining III, (11 August 2000); doi: 10.1117/12.395612; https://doi.org/10.1117/12.395612
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