Nano-spring arrays for high-density interconnect

David K. Fork; Christopher L. Chua; Patrick Kim; Linda T. Romano; Rachel Lau; Lai Wong; Andrew Alimonda; Vicki Geluz; Mark Teepe; Joe Haemer; Mitul B. Modi; Qi Zhu; Dennis L. Ma; Suresh Sitaraman; Donald L. Smith; Sammy Mok

doi:10.1117/12.395634

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15 August 2000 Nano-spring arrays for high-density interconnect

David K. Fork, Christopher L. Chua, Patrick Kim, Linda T. Romano, Rachel Lau, Lai Wong, Andrew Alimonda, Vicki Geluz, Mark Teepe, Joe Haemer, Mitul B. Modi, Qi Zhu, Dennis L. Ma, Suresh Sitaraman, Donald L. Smith, Sammy Mok

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Proceedings Volume 4176, Micromachined Devices and Components VI; (2000) https://doi.org/10.1117/12.395634
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

A new type of compliant interconnect derived from a thin metal film fabricated with a controlled stress profile is being developed for flip- flop interconnects and probing devices. Interconnections have been demonstrated on lateral pitches as tight as 6 microns. The interconnect is highly elastic and can provide up to hundreds of microns of vertical compliance.

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David K. Fork, Christopher L. Chua, Patrick Kim, Linda T. Romano, Rachel Lau, Lai Wong, Andrew Alimonda, Vicki Geluz, Mark Teepe, Joe Haemer, Mitul B. Modi, Qi Zhu, Dennis L. Ma, Suresh Sitaraman, Donald L. Smith, and Sammy Mok "Nano-spring arrays for high-density interconnect", Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); https://doi.org/10.1117/12.395634

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