18 August 2000 Practical aspects of micromachined gas distribution systems for semiconductor processing
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Proceedings Volume 4177, Microfluidic Devices and Systems III; (2000) https://doi.org/10.1117/12.395668
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Previously, we have reported the science and technology of micromachiend valves and orifices, and their integration to form high-performance mass-flow controllers (MFCs), and vacuum leak rate shut-off devices (SOVs). In this work, we expand the science and technology base of these devices, to include not only performance, but more practical aspects of their behavior. Specifically, for MFCs we have studied long-term drift, mean time tofail, particle generation, dry down after moisture contamination, gas replacement, effects of gravitational orientation, and sensitivity to inlet pressure and ambient temperature. For SOVs, we have studied mean time to fail, particle generation, dry down after moisture contamination, vacuum leak rate, and sensitivity to inlet pressure and ambient temperature.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Albert K. Henning, Brad A. Cozad, Elizabeth Lawrence, Errol B. Arkilic, and James M. Harris "Practical aspects of micromachined gas distribution systems for semiconductor processing", Proc. SPIE 4177, Microfluidic Devices and Systems III, (18 August 2000); doi: 10.1117/12.395668; https://doi.org/10.1117/12.395668
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