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22 August 2000 Development of modules for micro-optical integration and MOEMS packaging
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Proceedings Volume 4178, MOEMS and Miniaturized Systems; (2000) https://doi.org/10.1117/12.396481
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
For the transfer of micro optical and mechanical components to an application, packaging currently represents a major problem. The electrical, optical and mechanical components are typically fabricated with lithographic techniques. Thus the relative distances are accurate, but the absolute position on the substrate is defined by the quality of the separation tool. Thus active alignment is usually necessary for the assembly. For the development of standardized MOEM - modules, designed to eliminate the problems of alignment, technological, optical and function considerations have to be addressed.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Karl-Heinz Brenner "Development of modules for micro-optical integration and MOEMS packaging", Proc. SPIE 4178, MOEMS and Miniaturized Systems, (22 August 2000); https://doi.org/10.1117/12.396481
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