10 August 2000 Characterization of Kovar-Pyrex anodically bonded samples: a new packaging approach for MEMS devices
Author Affiliations +
Proceedings Volume 4180, MEMS Reliability for Critical Applications; (2000) https://doi.org/10.1117/12.395711
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system. Experimental bonds of Kovar plates and fixtures have been made to numerous Pyrex samples in order to investigate the strength and failure modes of these bonds. An emphasis on experimentally bonding at low temperatures (~200 $DEGC) using large voltages (< 2000V) was also a important parameter of this research and a current microvalve project at JPL. Bond strength measurements have been made using calibrated pull and burst tests with their results being comparable to typical silicon to Pyrex anodic bonds. Detailed bonding conditions for the tested samples have been included in this manuscript to aid the MEMS designer in using this approach to satisfy their packaging needs.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephen E. Vargo, Stephen E. Vargo, Amanda A. Green, Amanda A. Green, Juergen Mueller, Juergen Mueller, David P. Bame, David P. Bame, Robert H. Reinicke, Robert H. Reinicke, } "Characterization of Kovar-Pyrex anodically bonded samples: a new packaging approach for MEMS devices", Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); doi: 10.1117/12.395711; https://doi.org/10.1117/12.395711
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT

Silicon-glass anodic bonding at low temperature
Proceedings of SPIE (January 21 2005)
Vacuum wafer-level packaging for MEMS applications
Proceedings of SPIE (January 14 2003)
MEMS sensor packaging using LTCC substrate technology
Proceedings of SPIE (November 20 2001)
Reliability of fiber arrays
Proceedings of SPIE (May 29 2003)

Back to Top